Improve LED display performance through low heat dissipation_LED full-color display chipu200b|LED display manufacturer|Huaze Optoelectronics
The heat dissipation of the LED display screen has different considerations depending on the power size and the place of use. 1. Air fluid mechanics uses the shape of the lamp housing to create convective air, which is the lowest cost way to enhance heat dissipation. 2. Thermally conductive plastic shell, filled with thermally conductive material during injection molding of the plastic shell to increase the thermal conductivity and heat dissipation capacity of the plastic shell. 3. Aluminum fins, this is the most common way to dissipate heat. Use aluminum fins as a part of the housing to increase the heat dissipation area of u200bu200bthe led display. 4. The surface of the led display screen is treated with radiant heat, and the surface of the lamp housing is treated with radiant heat. The simple method is to apply a radiant heat dissipation paint to take the heat away from the surface of the lamp housing by radiation. 5. Heat pipe heat dissipation, using heat pipe technology to conduct heat from the LED full-color display chip to the shell heat dissipation fins. It is a common design in large lamps, such as street lamps. 6. Fan heat dissipation, long-life and high-efficiency fan is used inside the lamp housing to enhance heat dissipation. This method has low cost and good effect. However, it is troublesome to change the fan and it is not suitable for outdoor led display. This kind of design is relatively rare. 7. Liquid bulb, using liquid bulb packaging technology to fill the lamp body bulb with a transparent liquid with high thermal conductivity. This is currently the only technology that uses the light-emitting surface of the LED chip to conduct heat and dissipate heat in addition to the principle of light reflection. 8. Integration of heat conduction and heat dissipation-the use of high thermal conductivity ceramics, the purpose of lamp housing heat dissipation is to reduce the working temperature of the LED full-color display chip. Due to the large gap between the expansion coefficient of the LED chip and the daily metal heat conduction and heat dissipation materials, The LED display chip cannot be welded directly to avoid high and low temperature thermal stress from damaging the LED full-color display chip. The latest high thermal conductivity ceramic material, the thermal conductivity is close to aluminum, and the expansion system can be adjusted to synchronize with the LED full-color display chip. In this way, heat conduction and heat dissipation can be integrated, and the intermediate process of heat conduction can be reduced.